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INTEGRATED CIRCUITS
DATA SHEET
TDA4860 Vertical deflection power amplifier for monitors
Product specification Supersedes data of 1996 Nov 26 File under Integrated Circuits, IC02 1997 Oct 27
Philips Semiconductors
Product specification
Vertical deflection power amplifier for monitors
FEATURES * Vertical pre-amplifier with differential inputs * Powerless vertical shift * Flyback voltage generation suitable for two operating modes (doubling the supply voltage or external supply for the short flyback time, this achieves a minimum of power dissipation) * Vertical output stage with thermal and SOAR protection * High deflection frequency up to 160 Hz * High linear sawtooth signal amplification * Possibility of guarding the deflection * Voltage stabilizer. QUICK REFERENCE DATA Measurements referenced to substrate (pin 6). SYMBOL VP1 VP2 VP3 IP1 IP2 VI I5 M Tamb supply voltage (pin 1) supply voltage (pin 4) flyback supply voltage (pin 8) supply current (pin 1) supply quiescent current (pin 4) input voltage (pins 2 and 3) deflection output current (maximum value; pin 5) operating ambient temperature PARAMETER 9 9 9 - - 1.6 - -20 MIN. - - - - 9 - - - TYP. GENERAL DESCRIPTION
TDA4860
The TDA4860 is a vertical power amplifier for differential input signals suitable for colour monitor/TV systems with deflection frequencies up to 160 Hz.
MAX. 30 60 60 10 - 1 +75 V V V
UNIT
mA mA A C
VP1 - 0.5 V
ORDERING INFORMATION TYPE NUMBER TDA4860 PACKAGE NAME SIL9MPF DESCRIPTION plastic single in-line medium power package with fin; 9 leads VERSION SOT110-1
1997 Oct 27
2
Philips Semiconductors
Product specification
Vertical deflection power amplifier for monitors
BLOCK DIAGRAM
TDA4860
handbook, full pagewidth
TDA4860
VOLTAGE STABILIZER VERTICAL DRIVER THERMAL AND SOAR PROTECTION FLYBACK DRIVER
DIFFERENTIAL INPUT AMPLIFIER
VERTICAL OUTPUT
FLYBACK GENERATOR
PULSE CIRCUIT
1 VP1 +8.8 V 470 F
2
3 BAX13
4 VP2
5 V-OUT
6 SUB
7 FLB
8 VP3
9
PCO 5.6 270 1.8 k 1.8 k 0.1 F yoke R1 1 470 F VN -8.1 V 470 F 4.3 10 k RPCO
150 k
from TDA4850
1 M V-shift
+52 V
MHA591
Assumed values: Iyoke = 1.42 A. Ryoke = 4.17 + 7% + R(T) = 6.12 . Lyoke = 5.25 mH. R1 = 1.0 1%. Tamb = 65 C. Tj(max) = 105 C. Tyoke = 75 C. Pyoke = 1.2 W. PIC = 1.8 W. Ptot = 3.0 W. tp FLB = typically 250 s. Attention: the heatsink of the IC must be isolated against ground; the cooling fin is connected to pin 6.
Fig.1
Block diagram and application circuit with flyback supply voltage VP3 from an external source. Deflection frequency range from 50 Hz to 100 Hz.
1997 Oct 27
3
Philips Semiconductors
Product specification
Vertical deflection power amplifier for monitors
PINNING SYMBOL VP1 INP1 INP2 VP2 V-OUT SUB FLB VP3 PCO PIN 1 2 3 4 5 6 7 8 9 DESCRIPTION supply voltage 1 input 1 of differential input amplifier input 2 of differential input amplifier supply voltage 2 for vertical output stage vertical output substrate flyback generator output flyback supply voltage 3 pulse circuit output
handbook, halfpage
TDA4860
VP1 1 INP1 2 INP2 3 VP2 4 V-OUT 5 SUB 6 FLB 7 VP3 8 PCO 9
MHA593
TDA4860
Fig.2 Pin configuration.
FUNCTIONAL DESCRIPTION Differential input amplifier The differential sawtooth input signal (coming from a ramp output of the TDA4850 for example) is fed to the input pins 2 and 3. The non-inverted signal is attached to pin 3. The vertical feedback signal is superimposed on the inverted input signal on pin 2. Vertical shift is applied at the inputs in a power-less way (see Fig.1). Flyback generator Signals for the flyback generator and the pulse circuit are generated in the flyback driver stage. The flyback output consists of a Darlington transistor and a flyback diode. The flyback generator can operate in two modes: 1. An external supply voltage is applied for the short flyback time, thus the power dissipation is minimum (see Fig.1). 2. The flyback voltage is generated by doubling the supply voltage (see Fig.5). The 100 F capacitor C2 between pins 4 and 7 is charged up to VP1 during scan, using the external diode and the resistor R2. The cathode of the capacitor C2 is connected to the positive rail during flyback. Thus, the flyback voltage is twice the supply voltage.
Vertical output The vertical output stage is a quasi-complementary class-B amplifier with a high linearity. The output contains SOAR (short-circuit protection) and thermal protection. The output current on pin 5 is reduced for a short time (to let the temperature decrease to Tj < 150 C), when the junction temperature (Tj) exceeds 160 C. Deflection GUARD Pin 9 will go HIGH if the junction temperature goes to high (see Fig.3). A pulse signal with 50% duty cycle is output on pin 9, if the deflection coil is open-circuit. A flyback pulse signal is output at normal conditions. Further watching can be achieved by means of an external GUARD circuit as shown in Fig.4. The 22 F capacitor is charged during flyback time (V5 > V8) at normal conditions. In case of failures, the capacitor is discharged and the GUARD output goes HIGH. GUARD output level (see Fig.4): * LOW for normal conditions * HIGH for deflection coil short-circuit respectively open-circuit * HIGH when there are neither input or output signals.
1997 Oct 27
4
Philips Semiconductors
Product specification
Vertical deflection power amplifier for monitors
TDA4860
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134); voltages referenced to substrate (pin 6); unless otherwise specified. SYMBOL VP1 VP2 VP3 V2,3,9 V5,7 I4 I5 (M) I7 (M) I9 Tstg Tamb Tj Ves Notes 1. Internally limited by thermal protection; switching temperature point at 160 8 C. 2. Equivalent to discharging a 200 pF capacitor through a 0 series resistor. THERMAL CHARACTERISTICS SYMBOL Rth j-c PARAMETER thermal resistance from junction to case VALUE 10 UNIT K/W PARAMETER supply voltage (pin 1) supply voltage (pin 4) supply voltage (pin 8) voltage on pins 2, 3 and 9 voltage on pins 5 and 7 current on pin 4 output current on pin 5 (peak value) flyback current on pin 7 (peak value) current on pin 9 storage temperature operating ambient temperature junction temperature electrostatic handling for all pins note 1 note 2 note 1 CONDITIONS - - - - - - - - - -25 -20 - - MIN. MAX. 40 60 60 VP1 60 1 1.3 1.3 -8 +150 +75 168 300 V V V V V A A A mA C C C V UNIT
The heatsink can be estimated according to application circuit (see Fig.1): T j(max) - T amb 105 C - 65 C R th j-a = R th j-c + R th c-h + R th h-a = ---------------------------------- = ---------------------------------------- = 22.2 K/W . P IC(max) 1.8 W A heatsink is needed at Rth j-c < 10 K/W and Rth c-h = 0.5 K/W (using silicon grease) with Rth h-a = 22.2 K/W - (10 + 0.5) K/W = 11.7 K/W.
1997 Oct 27
5
Philips Semiconductors
Product specification
Vertical deflection power amplifier for monitors
TDA4860
CHARACTERISTICS VP1 = VP2 = 25 V; VN = V6 = 0 V; Tamb = 25 C; voltages referenced to substrate (pin 6); unless otherwise specified. SYMBOL VP1 VP2 VP3 IP1 IP2 V2,3 I2,3 V7 I7(M) V1-5 tp FLB V5 I5(M) LIN PARAMETER supply voltage 1 (pin 1) supply voltage 2 (pin 4) supply voltage 3 (pin 8) supply current (pin 1) quiescent supply current (pin 4) without input signal CONDITIONS 9 9 9 - - MIN. TYP. 25 25 - - 9 - 100 MAX. 30 60 60 10 - V V V mA mA UNIT
Pre-amplifier input voltage (pins 2 and 3) input quiescent current without input signal 1.6 - VP1 - 0.5 V - nA
Flyback generator output voltage flyback output current (maximum value; pin 7) threshold voltage to switch flyback flyback pulse time on/off threshold see Figs 1 and 3 upper value; I7 = -1 A - - - - VP3 - 2.2 - - 1.4 250 1 - - - 1.7 1 1 V A V s
Vertical output; see Fig.3 output voltage vertical output current (maximum value; pin 5) non-linearity of output signal upper value; I5 = -1 A VP2 - 2.3 VP2 - 2 lower value; I5 = 1 A - - - 1.5 - - - V V A %
Pulse circuit output; see Fig.3 V9 V9 V1-5 tp9 output voltage output voltage for thermal protection active voltage to insert flyback pulse on pin 9 normal condition pulse width normal condition RPCO = 10 k; see Fig.1 0.4 VP1 - 0.4 V - 1.4 - - V V % s
VP1 - 0.4 - - tp FLB - 50 -
deflection open-circuit -
1997 Oct 27
6
Philips Semiconductors
Product specification
Vertical deflection power amplifier for monitors
TDA4860
handbook, full pagewidth
INP1 input signal on pin 2
t INP2 input signal on pin 3
V-OUT
tpFLB = 250 s
t
output signal on pin 5
t PCO tp9 output signal on pin 9 for normal condition
t PCO 50% output signal on pin 9 for deflection unit open-circuit
t PCO output signal on pin 9 for thermal protection active
t
MEH361
Fig.3 Vertical timing.
1997 Oct 27
7
Philips Semiconductors
Product specification
Vertical deflection power amplifier for monitors
APPLICATION INFORMATION
TDA4860
k, full pagewidth
VP3 8 VP BAX13 >1 k 2.2 2N5819 vertical output signal GUARD output HIGH = error BC548 22 F 220 k
MEH262
TDA4860
5
3.3 k
Fig.4 GUARD circuit application on vertical output.
handbook, full pagewidth
TDA4860
VOLTAGE STABILIZER VERTICAL DRIVER THERMAL AND SOAR PROTECTION FLYBACK DRIVER
DIFFERENTIAL INPUT AMPLIFIER
VERTICAL OUTPUT
FLYBACK GENERATOR
PULSE CIRCUIT
1 VP1 +9 V 470 F
2
3
4 VP2 BAX13
5 V-OUT
6 SUB C2 100 F
7 FLB
8 VP3
9
PCO
5.6 150 k 1.8 k 1.8 k 270 0.1 F 5.25 mH yoke R1 1 R2 240 10 k RPCO
from TDA4850
470 F VN -7.8 V
MHA592
1 M V-shift
Fig.5 Application for flyback voltage generation by doubling the supply voltage.
1997 Oct 27
8
Philips Semiconductors
Product specification
Vertical deflection power amplifier for monitors
TDA4860
VP1 handbook, full pagewidth 1
INP1 2
INP2 3
VP2 cooling fin 4
V-OUT SUB 5 6 7
VP3 8
PCO 9
TDA4860
MEH266
Fig.6 Internal circuitry.
1997 Oct 27
9
Philips Semiconductors
Product specification
Vertical deflection power amplifier for monitors
PACKAGE OUTLINE SIL9MPF: plastic single in-line medium power package with fin; 9 leads
TDA4860
SOT110-1
D
D1 q P P1 A2
A3 q1 q2
A A4 seating plane E pin 1 index
L 1 Z b2 e b b1 wM 9 Q
c
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 18.5 17.8 A2 max. 3.7 A3 8.7 8.0 A4 15.8 15.4 b 1.40 1.14 b1 0.67 0.50 b2 1.40 1.14 c 0.48 0.38 D (1) 21.8 21.4 D1 21.4 20.7 E (1) 6.48 6.20 e 2.54 L 3.9 3.4 P 2.75 2.50 P1 3.4 3.2 Q 1.75 1.55 q 15.1 14.9 q1 4.4 4.2 q2 5.9 5.7 w 0.25 Z (1) max. 1.0
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT110-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-02-25
1997 Oct 27
10
Philips Semiconductors
Product specification
Vertical deflection power amplifier for monitors
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA4860
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1997 Oct 27
11
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For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1996
Internet: http://www.semiconductors.philips.com
SCA52
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
547047/1200/03/pp12
Date of release: 1997 Oct 27
Document order number:
9397 750 02782

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